发明名称 VALVE DEVICE AND MULTILAYERED SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide superior workability when carrying out electrical joining with respect to a multilayered substrate, to miniaturize a device by simplifying a configuration of the device, and to reduce its manufacturing costs. <P>SOLUTION: In the valve device 1, the multilayered substrate 2 formed with fluid passages (an inflow passage 25, a valve chest 26, an outflow passage 27) and electric wiring is fixed, and it is characterized by that it is equipped with a diaphragm 10 arranged in a position capable of opening and closing the passages, a stepping motor 5 reciprocating the diaphragm 10 to open and close the passages, and a base 3 holding the diaphragm 10 in a state holding it with the multilayered substrate 2 when the valve device 1 is fixed to the multilayered substrate 2. A terminal part electrically joined to the electric wiring is provided in a neighborhood of a fixing face with respect to the multilayered substrate 2. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009127704(A) 申请公布日期 2009.06.11
申请号 JP20070301781 申请日期 2007.11.21
申请人 ALPS ELECTRIC CO LTD;CASIO COMPUT CO LTD 发明人 KATO TAKUYA;KIHARA TAKASHI;KABASAWA YASUNARI
分类号 F16K31/04;F16K27/00;H01M8/04 主分类号 F16K31/04
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