| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting device in which a cutting blade can moderately cut a dicing tape. <P>SOLUTION: The cutting device is provided with a chuck table holding a wafer arranged in a frame through the dicing tape, a cutting means to which the cutting blade cutting the wafer held by the chuck table is rotatably installed, an alignment means which image-picks up the wafer held by the chuck table and detects a region to be cut and a cutting feeding means which feeds the chuck table for cutting to a direction orthogonal to a rotation axis of the cutting blade and which can be positioned just under the alignment means. The device is also provided with a laser length measuring means installed adjacently to the alignment means. The laser length measuring means detects depth of a cutting groove which is cut in the dicing tape when the cutting means cuts the wafer disposed in the frame through the dicing tape and it is positioned just below by the cutting feeding means. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
