| 摘要 |
A cooling device (1) comprises a top plate (2), a bottom plate (3), an axial flow inlet (4) in the top plate (2), a rotor support (5) on the top plate (2), and a pump rotor fan (6). The outer dimensions are 40 mm in diameter and 4 mm in height. The internal separation of the plates 2 and 3 is 4 mm. The cooling device (1) has a low profile in scale. Depending on the configuration and on operating parameters steady or unsteady fluid flow vortices can be created in the heat sink. The resulting flow field enhances heat transfer rates locally through impingement cooling and thermal transport by the vortices, whether generated to be steady or unsteady in nature. Also, the vortices drive a secondary flow within the heat sink, effectively creating a pumping mechanism, which further enhances heat transfer. The heat sink is simple, economical to construct and integrate within portable electronics such as mobile phones, and provides the possibility of utilizing existing components and architectures within electronic devices as the heat sink body. For example one or more heat sink surfaces may be surfaces of existing components such as a circuit board or a housing.
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