| 摘要 |
A thermosetting conductive paste composition is provided to solve the deviation of resistance and gas generation which is a disadvantage of copper paste, and to ensure high conductivity, low shrinkage rate and excellent high temperature and high humidity reliability. A though hole paste composition for double-sided printed circuit board maximizing space efficiency comprises, if copper through-hole paste is used, on a basis of ternary system mixing of copper powder based on the total weight, inorganic filler 60~80 weight%, epoxy resin 10~20 weight%, reactive diluent binder 1~10%, polyimide polymer 1~5%, hardener 0~1% and stabilizer 0~1%. The ternary system mixing of the copper powder comprises needle copper powder.
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