| 摘要 |
A heat dissipation device includes a base for thermally engaging with an electronic device, a base for thermally engaging with the heat generating electronic device, a fin assembly consisting of a plurality of fins arranged on the base, a first heat pipe and a second heat pipe. The first heat pipe comprises two evaporation sections engaged in the base, two interconnecting condensation sections parallel to the evaporation sections and respectively thermally inserted in the central portion of the fin assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation sections. The second heat pipe comprising two evaporation sections engaged in the base, two interconnecting condensation sections parallel to the evaporation sections and respectively thermally inserted in the upper portion of the fin assembly far away from the base, and two connecting sections interconnecting corresponding condensation sections and evaporation sections of the second heat pipe. |
