发明名称 |
TECHNIQUE FOR PLATING SUBSTRATE DEVICES USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL AND LIGHT ASSISTANCE |
摘要 |
<p>An electroplating process is performed using a substrate that includes a thickness of voltage switchable dielectric (VSD) material having photoactive components that are dispersed, mixed or dissolved in a binder of the VSD material. A pattern of conductive elements may be formed on the substrate by switching the VSD material from a dielectric state to a conductive state using, in part, voltage generated by directing light onto the thickness and VSD material.</p> |
申请公布号 |
EP2067145(A2) |
申请公布日期 |
2009.06.10 |
申请号 |
EP20070843088 |
申请日期 |
2007.09.24 |
申请人 |
SHOCKING TECHNOLOGIES, INC. |
发明人 |
KOSOWSKY, LEX;FLEMING, ROBERT |
分类号 |
H01B1/24;C23C18/16;C25D5/02;C25D5/10;C25D5/54;H01B1/22 |
主分类号 |
H01B1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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