发明名称 TECHNIQUE FOR PLATING SUBSTRATE DEVICES USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL AND LIGHT ASSISTANCE
摘要 <p>An electroplating process is performed using a substrate that includes a thickness of voltage switchable dielectric (VSD) material having photoactive components that are dispersed, mixed or dissolved in a binder of the VSD material. A pattern of conductive elements may be formed on the substrate by switching the VSD material from a dielectric state to a conductive state using, in part, voltage generated by directing light onto the thickness and VSD material.</p>
申请公布号 EP2067145(A2) 申请公布日期 2009.06.10
申请号 EP20070843088 申请日期 2007.09.24
申请人 SHOCKING TECHNOLOGIES, INC. 发明人 KOSOWSKY, LEX;FLEMING, ROBERT
分类号 H01B1/24;C23C18/16;C25D5/02;C25D5/10;C25D5/54;H01B1/22 主分类号 H01B1/24
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