METHOD AND DEVICE FOR WETTING THE BUMPS OF A SEMICONDUCTOR CHIP WITH SOLDERING FLUX

摘要

The present invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container, which accommodates the soldering flux and is open on the bottom, and a base plate, which contains at least one cavity, are moved back-and-forth in relation to one another on one side of the cavity to the other side of the cavity. The viewed in the movement direction front wall of the container is lifted up during the relative movement, so that it is located at a distance above the base plate. The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the base plate. This measure has the effect that the front wall of the container does not convey any soldering flux onto the base plate, which has caused the loss of this soldering flux until now.