A light emitting device is provided, comprising a light emitting diode 10, where the light emitting surface 11 thereof is bound to an optical element 13 by means of a bonding material 12 comprising a phosphate glass or an oxide glass having Tg<250° C. In operation of the device, when the temperature approaches or exceeds Tg of the bonding material, the bonding material gets fluidic and can thus relax any thermally induced stresses between the light emitting diode and the optical element.
申请公布号
EP2067182(A2)
申请公布日期
2009.06.10
申请号
EP20070826424
申请日期
2007.09.18
申请人
KONINKLIJKE PHILIPS ELECTRONICS N.V.
发明人
OFFERMANS, PAULUS, H., G.;BECKERS, LUCAS, J., A., M.