| 摘要 |
<p>A printed wiring board, comprising: a plurality of resin insulation layers each having openings for via conductors; a plurality of conductive layers each having a conductive circuit; via conductors formed in the openings and connecting conductive circuits formed in separate conductive layers among the conductive layers; and a plurality of component-loading pad for loading an electronic component formed on an uppermost resin insulation layer positioned as an outermost layer of the plurality of resin insulation layers, wherein the resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed from a copper foil is provided.</p> |
