发明名称 Leistungshalbleitermodul in Druckkontaktausführung
摘要 The module has load connection units (40, 42, 44) designed as a metal molded body with strip-like sections (402, 422, 442) and with a set of contact bases (400, 420, 440). The strip-like sections are arranged parallel to a surface of a substrate and are spaced apart from the surface of the substrate. An insulating material molding body (30) is arranged between the strip-like sections and the substrate, and includes recesses (32) for holding the contact bases.
申请公布号 DE102006006425(B4) 申请公布日期 2009.06.10
申请号 DE20061006425 申请日期 2006.02.13
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 LEDERER, MARCO;POPP, RAINER
分类号 H01L23/48;H01L23/053;H01L23/34;H01L25/07 主分类号 H01L23/48
代理机构 代理人
主权项
地址