| 摘要 |
The invention relates to an interconnection for chip sandwich structures by means of which chips can be electrically and mechanically connected to one another face-to-face, and to a method for the production thereof. The invention is intended to create interconnections that can be produced more cost-effectively and more effectively. This is achieved by virtue of the fact that pin- or sleeve-shaped contact elements ( 3 ) are arranged between the chips ( 1, 2 ), which contact elements create an electrical and mechanical interconnection between the contact pads ( 4, 5 ) of the semiconductor chips ( 1, 2 ) and are soldered to the latter. |
