摘要 |
<p>The unit (1) has contact springs (7a, 7b) exhibiting a contact area, and formed and/or supported springily such that the contact area of the contact springs is pressed against a connection contact (5) of an electronic component (3) i.e. integrated circuit, in a test position of the component relative to the unit. The contact springs are provided with multiple separate springily contact spring parts, which exhibit a partial contact region of the contact area, where the contact springs are arranged in an opening (15) within the unit. Independent claims are also included for the following: (1) a testing device for testing electronic components, comprising a carrier (2) a method for contacting connection contacts of electronic components with a contacting unit.</p> |