发明名称 Method for integrating DMOS into sub-micron CMOS process
摘要 This invention is forming the DMOS channel after CMOS active layer before gate poly layer to make the modular DMOS process step easily adding into the sub-micron CMOS or BiCMOS process. And DMOS source is formed by implant which is separated by a spacer self-aligned to the window for DMOS body. By this method, the performance of CMOS and bipolar devices formed original CMOS or BiCMOS process keeps no change. The product design kit, such as standard cell library of CMOS and BiCMOS, can be used continuously with no change.
申请公布号 US7544558(B2) 申请公布日期 2009.06.09
申请号 US20060373278 申请日期 2006.03.13
申请人 BCD SEMICONDUCTOR MANUFACTURING LIMITED 发明人 REN CHONG;LIU XIAN-FENG;TAO HUANG HAI
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
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