发明名称 Method of fabricating silicon nitride layer and method of fabricating semiconductor device
摘要 A method of fabricating a silicon nitride layer is described. First, a substrate is provided. Then, a silicon nitride layer is formed on the substrate. The silicon nitride layer is UV-cured in an atmosphere lower than the standard atmospheric pressure. Through the UV curing treatment, the tensile stress of the silicon nitride layer is increased.
申请公布号 US7544603(B2) 申请公布日期 2009.06.09
申请号 US20050233831 申请日期 2005.09.22
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHEN NENG-KUO;TSAI TENG-CHUN;LIAO HSIU-LIEN
分类号 H01L21/20 主分类号 H01L21/20
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