Heat radiating printed circuit board and semiconductor chip package,申请号KR20070098381-传众专利搜索

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发明名称	Heat radiating printed circuit board and semiconductor chip package
摘要
申请公布号	KR100902128(B1)	申请公布日期	2009.06.09
申请号	KR20070098381	申请日期	2007.09.28
申请人		发明人
分类号	H01L23/34	主分类号	H01L23/34
代理机构		代理人
主权项
地址

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