PLATING APPARATUS AND PLATING METHOD

摘要

A plating device and a plating method are provided to increase the thickness uniformity of a plating film by maintaining uniform potential distribution through the front side of a wafer. A plating device comprises: a plating bath(10) maintaining the plating liquid(Q); an anode(26) dipped in the plating liquid within the plating bath; a holder(24) arranging a wafer to the opposite location of the anode; a pedal(32) arranged between the anode, and the wafer supported with the holder, to shuttle on the wafer to agitate the plating liquid; and a controller controlling a pedal driving part. The controller controls the pedal driving part to make an absolute value average of the pedal transition speed reach 70~100 cm/sec.