发明名称 Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method
摘要 A plasma treatment apparatus is provided, which enables to increase a treatment area and provide good treatment uniformity. This apparatus comprises a pair of electrode plates having a plurality of through holes and an insulating plate having a plurality of through holes. The insulating plate is disposed between the electrode plates such that positions of the through holes of the electrode plates correspond to the positions of the through holes of the insulating plate. A plurality of discharge spaces are formed by the through holes of the electrode plates and the through holes of the insulating plate. By applying a voltage between the electrode plates, while supplying a plasma generation gas into the discharge spaces, plasmas are generated simultaneously in the discharge spaces, and sprayed on an object to efficiently perform a large-area, uniform plasma treatment.
申请公布号 US7543546(B2) 申请公布日期 2009.06.09
申请号 US20050529861 申请日期 2005.03.31
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 SHIBATA TETSUJI;YAMAZAKI KEIICHI;TAGUCHI NORIYUKI;SAWADA YASUSHI
分类号 C23C16/00;B01J19/08;C23C4/00;H01J37/32;H01L;H01L21/00;H01L21/304;H01L21/3065;H05H1/00;H05H1/24;H05H1/46;H05K3/26 主分类号 C23C16/00
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