| 摘要 |
A method for monitoring of semiconductor chip and its system are provided to monitor the exact fail site to accurately analyze by automatically matching the electrical defect discovered in the analysis in the layout of chip. A tool bar option for dividing a semiconductor chip is decided. The determined tool bar as described above and an optic image are picture-composed and outputted. The electrical defect in the analysis is detected by using a tool. The detected electrical defect is picture-composed and outputted. The detection image of the electrical defect is matched in the screen configuration of being outputted to the optic image to the superimpose image. The matched superimpose image as described above is picture-composed and outputted. In the step of determining tool bar option, the equal part number of the semiconductor chip is determined in order to the same ratio divide in tool.
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