发明名称 Method for manufacturing semiconductor laser element
摘要 The method for manufacturing a semiconductor laser element according to the present invention has the steps of: forming a semiconductor laminated structure having an active layer composed of a semiconductor material containing Al; etching the semiconductor laminated structure to form a mesa; forming a first burying layer at a first growing temperature so as to coat the side of the mesa; and forming a second burying layer at a second growing temperature higher than the first growing temperature on the first burying layer to bury the circumference of the mesa.
申请公布号 US7544535(B2) 申请公布日期 2009.06.09
申请号 US20070625617 申请日期 2007.01.22
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 WATATANI CHIKARA;OTA TORU;NAGIRA TAKASHI
分类号 H01L21/00 主分类号 H01L21/00
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