发明名称 Method for fabricating thin layer device
摘要 A method for producing a thin layer device such as a superconductive device excellent in mechanical strength and useful as a submillimeter band receiver is provided. The thin layer device is produced by forming a multilayer structure substance comprising an NbN/MgO/NbN-SIS junction on an MgO temporary substrate, then forming SiO2, as a substrate, on said multilayer structure substance, and subsequently removing the MgO temporary substrate by etching. A superconductive device (a thin layer device) produced by a method of the present invention has excellent performance and high mechanical strength, and therefore introduction to a waveguide for a submillimeter band is also easy.
申请公布号 US7544964(B2) 申请公布日期 2009.06.09
申请号 US20060525997 申请日期 2006.09.25
申请人 NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY, INCORPORATED ADMINISTRATIVE AGENCY 发明人 KAWAKAMI AKIRA
分类号 H01L39/22;H01L21/84 主分类号 H01L39/22
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