Surface treatment method of wafer by using floating zone process and surface treatment apparatus for the same,申请号KR20080006466-传众专利搜索

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发明名称	Surface treatment method of wafer by using floating zone process and surface treatment apparatus for the same
摘要
申请公布号	KR100901980(B1)	申请公布日期	2009.06.08
申请号	KR20080006466	申请日期	2008.01.22
申请人		发明人
分类号	H01L21/304;H01L21/02	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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