| 摘要 |
<p>A method for measuring an overlay of a semiconductor device is provided to secure reproduction of a tack file and to improve yield by preventing a production error due to selection error of an overlay mark. A measurement wafer is loaded in an overlay measuring device(S1). The measurement wafer includes a shot with dies and an overlay mark at each corner of the shot. The overlay mark is selected by the overlay measuring device(S2). An interlock is set according to the interval between the selected overlay mark(S3). The overlay value detected from the overlay measuring device is stored(S4).</p> |
