| 摘要 |
An electrochemical plating device and a copper layer forming method using the same are provided to measure the thickness of copper plating in an in-situ method without separate measuring equipment. An electrochemical plating device comprises a reservoir(100), a copper target(120) placed on the bottom of the reservoir, a detection plate(140) which is placed opposite to the copper target, and a detection unit(150) which is connected to the detection plate to detect the endpoint of copper plating. A wafer(130) is placed opposite to the copper target, and applied with electric potential equal to that applied to the detection plate. The detection unit obtains the mass variation of copper plated on the detection plate from the oscillation variation of the detection plate including platinum or crystal oscillator, and determines the endpoint of copper plating by using the copper mass variation.
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