| 摘要 |
<p>A slim type LED package is provided to reduce whole thickness of a LED package by overlapping thickness of a LED chip and a part of thickness of a lead frame. A first lead frame(12) and second lead frame(14) are separated each other. A chip mounting groove(121) is formed on one region of a top surface of the first lead frame. A LED chip(2) is connected to the second lead frame by a bonding wire(W). A light-transmissive encapsulating material(20) supports the first lead frame and the second lead frame, and protects the LED chip. The chip mounting groove is formed by etching one region of the top surface of the first lead frame. A bonding groove is formed on one region of a top surface of the second lead frame. One end of the bonding wire is bonded inside the bonding groove.</p> |
