发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>A semiconductor light emitting device package and a manufacturing method thereof are provided to form a structure for an air gap without an additional process by protruding an end of an electrode pattern from an upper part of the substrate. A semiconductor light emitting device package includes a semiconductor light emitting package device structure and a lens(300). A semiconductor light emitting device is mounted on the semiconductor light emitting device package. A first electrode pattern(150) and a second electrode pattern(160) are electrically connected to the semiconductor light emitting device. The ends of the first and second electrodes are protruded from the upper surface of the substrate. A lens structure is formed in the upper part of the first and second electrode patterns.</p> |
申请公布号 |
KR20090057662(A) |
申请公布日期 |
2009.06.08 |
申请号 |
KR20070124339 |
申请日期 |
2007.12.03 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
PARK, CHIL KEUN;SONG, KI CHANG |
分类号 |
H01L33/58 |
主分类号 |
H01L33/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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