MANUFACTURING METHOD OF PACKAGE IN CAMERA MODULE USING PCB PANEL AND PCB PANEL

摘要

A method for manufacturing a package on a camera module by using a PCB(Printed Circuit Board) panel and the PCB panel thereof are provided to lower manufacturing cost by removing an outer shape processing process and increase manufacturing efficiency per PCB panel by increasing cutting precision. One unit substrate array is formed by vertically arranging a plurality of unit boards including a circuit pattern on a PCB. A PCB panel is manufactured by horizontally arranging the unit substrate arrays. A part between the neighboring unit substrate arrays is cut by using a dicing saw(S130). A package array is formed by mounting the part for forming a camera module on each unit substrate of the PCB panel(S160). Each package is separated by cutting the neighboring packages(S170).