发明名称 Mold for injection molding and molding method using the same
摘要 <p>A mold for injection molding and a molding method using the same, in which multiple gates are provided to a curved runner, thereby easily molding a product having a complicated shape and a large width, and in which a plurality of curved runners are provided, thereby easily ejecting forms that are filled in the runners. The mold includes first and second molds defining a mold cavity, a first gate disposed at a first position of the mold cavity, a second gate disposed at a second position of the mold cavity spaced apart from the first position, a first curved runner provided to the second mold so as to be connected to the first gate, and a second curved runner provided to the second mold so as to be connected to the second gate. The first and second curved runners have inlets that are connected with each other, and cross-sectional areas that are gradually reduced from the inlets to the first and second gates.</p>
申请公布号 SK50282009(A3) 申请公布日期 2009.06.05
申请号 SK20090005028 申请日期 2007.10.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI DUCK SU;LEE SANG BAE;PARK IM BONG;JEONG RAE HAK
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