发明名称 SOLID-STATE IMAGING DEVICE
摘要 <p>Provided is an image sensor having a large ratio of the surface area of a light receiving portion to the surface area of one pixel. A solid-state imaging device comprises solid-state imaging elements arranged on a substrate. The solid-state imaging elements include a signal line formed on the substrate, an island semiconductor region disposed on the signal line, and a pixel selection line connected to an upper part of the island semiconductor region. The island semiconductor region includes a first semiconductor layer disposed on a lower part of the island semiconductor region and connected to the signal line, a second semiconductor layer adjacent to the upper side of the first semiconductor layer, a gate connected through an insulating film to the second semiconductor layer, a charge storage portion connected to the second semiconductor layer and including a third semiconductor layer, the charge amount of which changes when receiving light, and a fourth semiconductor layer disposed adjacent to the upper sides of the second and third semiconductor layers and connected to the pixel selection line. The solid-state imaging elements are arranged in a honeycomb shape on the substrate.</p>
申请公布号 KR20090057351(A) 申请公布日期 2009.06.05
申请号 KR20087032238 申请日期 2008.03.21
申请人 UNISANTIS ELECTRONICS (JAPAN) LTD. 发明人 MASUOKA FUJIO;NAKAMURA HIROKI
分类号 H01L27/146 主分类号 H01L27/146
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