| 摘要 |
A semiconductor package structure and the applications thereof and the manufacturing method are disclosed. The semiconductor package structure includes a carrier, a semiconductor device, a first package body, a lid and a second package body. The semiconductor device is electrically connected to the carrier via a first conductive element. The first package body is molded on the carrier to surround the semiconductor device. The lid is disposed on top of the first package body and has at least one protrusion. The second package body is molded on the carrier to encapsulate the protrusion, whereby the protrusion is embedded within the second package body thereby locking the lid in place against the first package body.
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