发明名称 |
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD |
摘要 |
The present invention relates to a method for manufacturing printed circuit boards. A substrate including a base and two conductive layers on two opposite surfaces of the base is provided. A through-hole passing through the base and the conductive layers is defined in the substrate. A metal layer is formed on the substrate. The metal layer has a first portion on an outer surface of the substrate and a second portion on an inner surface in the through-hole thereof. A protecting material is applied onto the metal layer in the through-hole, an unwanted section of the first portion of the metal layer is removed. Electrical traces in each of the conductive layers are formed.
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申请公布号 |
US2009139086(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
US20080207333 |
申请日期 |
2008.09.09 |
申请人 |
FOXCONN ADVANCED TECHNOLOGY INC. |
发明人 |
YEH TSO-HUNG;CHANG HUNG-YI;CHEN CHIA-CHENG |
分类号 |
H05K3/10;H05K3/36 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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