发明名称 |
SURFACE MOUNTED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
The present invention provides a surface mounted semiconductor device 1 formed by cutting an assembly board together with cathode wiring patterns 8 and anode wiring patterns 10 arranged on the assembly board on which light-emitting elements are mounted. When the surface mounted semiconductor device 1 is mounted on a mounting board with the cutting plane (bonding surface) facing the mounting board, the cathode wiring patterns 8 serve as cathode connection electrodes 15 and the anode wiring patterns 10 serve as anode connection electrodes 12. A substantially semi-elliptical notch 16 is formed in each of the anode connection electrodes 12. A substantially fan-shaped notch 14 is formed in the corner of each of the cathode connection electrodes 15. Thus, it is possible to provide a surface mounted semiconductor device that can prevent a poor connection and ensure the bond strength by forming a solder fillet reliably, even if burrs are produced on the connection electrodes formed by cutting the assembly board. |
申请公布号 |
US2009139755(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
US20060063732 |
申请日期 |
2006.08.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KUSANO TOMOYUKI;ISHIBASHI KAZUHIRO;ONIZUKA TAKAAKI |
分类号 |
H05K1/18;H01L33/48;H01L33/62;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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