SIDE-EMITTING LED LIGHT SOURCE FOR BACKLIGHTING APPLICATIONS
摘要
This invention relates to a side-emitting light device comprising two sub- assemblies which are optically bonded together. Each sub-assembly comprises a substrate, at least one light source disposed on the substrate, and a luminescent plate optically bonded with the at least one light source. The light source emits light of a wavelength capable of exciting luminescence light from the luminescent plate. The two sub-assemblies are arranged having the free surface of the luminescent plates facing each other. The side-emitting light device is for instance applicable for light sources comprising naked dies arranged with Thin Film Flip Chip (TFFC) technique or laser diodes.
申请公布号
WO2009050623(A3)
申请公布日期
2009.06.04
申请号
WO2008IB54172
申请日期
2008.10.10
申请人
KONINKLIJKE PHILIPS ELECTRONICS N.V.;VAN SPRANG, HENDRIK, A.;DE GRAAF, JAN