| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being assembled by a method without increasing the numbers of parts and processes in the assembling for fixing a child substrate to a parent substrate. SOLUTION: In this semiconductor device, a first heat generating element 3 to which a first radiating means 5 is attached is mounted on a parent substrate 1; a second heat generating element 4 to which a second radiating means 6 is attached is mounted on a child substrate 2; and the first radiating means 5 and the second radiating means 6 are fixed so that the parent substrate 1 and the child substrate 2 enter into a predetermined positional relation. COPYRIGHT: (C)2009,JPO&INPIT |
