| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for optical semiconductor element, capable of obtaining a cured product excellent in heat resistance and light resistance with no discoloration stemming from the heat generation and light emission of a light-emitting element, excellent in adhesiveness to a housing material, and capable of maintaining high luminance over a long period, to provide a sealing agent for optical semiconductor element, to provide a die-bonding material for optical semiconductor element, to provide an underfilling material for optical semiconductor element, and to provide such an optical semiconductor element using them. <P>SOLUTION: The resin composition for optical semiconductor element comprises (A) a silicone resin having in the molecule one or more epoxy-containing groups, (B) an acid anhydride thermocuring agent reactive with the epoxy-containing group(s) and (C) a compound having in the molecule a structural unit represented by general formula (1): R-N=C-. In general formula (1), R is a 1-12C cyclic or branched alkyl chain optionally having halogen group(s), aryl group(s) or vinyl group(s), 5-8C cycloalkyl chain, a 1-12C cyclic or branched alkoxyl chain having an alkyl chain and optionally having halogen group(s), aryl group(s) or vinyl group(s), or a 1-6C aryl group optionally having alkyl substituent(s) or halogen group(s). <P>COPYRIGHT: (C)2009,JPO&INPIT |
