发明名称 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion
摘要 Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.
申请公布号 US2009142493(A1) 申请公布日期 2009.06.04
申请号 US20070927671 申请日期 2007.10.29
申请人 发明人 ZHANG GANG;COHEN ADAM L.
分类号 B05D3/00;B05D1/32;C25D1/00;C25D5/02;C25D5/10;C25D5/12;C25D5/14;C25D5/18;C25D5/34;C25D5/40;C25D5/48;C25D5/50;H01L21/288;H01L21/768;H05K3/24 主分类号 B05D3/00
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