发明名称 |
METHOD FOR POLISHING A WORKPIECE |
摘要 |
A polishing apparatus can supply a polishing liquid uniformly and efficiently to a surface to be polished of a workpiece. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding a semiconductor wafer and pressing the semiconductor wafer against the polishing surface. The polishing apparatus also includes a polishing liquid supply port for supplying a polishing liquid to the polishing surface, and a moving mechanism for moving the polishing liquid supply port to distribute the polishing liquid uniformly over an entire surface of the workpiece due to relative movement of the workpiece and the polishing surface.
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申请公布号 |
US2009142990(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
US20090367037 |
申请日期 |
2009.02.06 |
申请人 |
KOHAMA TATSUYA;KOBATA ITSUKI;NOMURA TOSHIKAZU |
发明人 |
KOHAMA TATSUYA;KOBATA ITSUKI;NOMURA TOSHIKAZU |
分类号 |
B24B49/04;B24B37/00;B24B37/005;B24B37/07;B24B37/20;B24B49/10;B24B49/12;B24B57/02;H01L21/304 |
主分类号 |
B24B49/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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