发明名称 |
Led structure for flip-chip package and method thereof |
摘要 |
LED structure can be packaged by using flip-chip package. An LED structure is covered by a conduction enhancing layer. A bumping area definition layer is then formed on the conduction enhancing layer to expose bumping area portions with p-pad and n-pad underneath, and a bumping pad is then formed over the bumping area portions. The bumping area definition layer and then exposed conduction enhancing layer is removed subsequently.
|
申请公布号 |
US2009140282(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
US20080292716 |
申请日期 |
2008.11.25 |
申请人 |
UNIT LIGHT TECHNOLOGY INC. |
发明人 |
WU BOR-JEN;WU MEI-HUI;CHEN CHIEN-AN;CHANG YUAN-HSIAO |
分类号 |
H01L33/40;H01L33/44;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|