发明名称 WORKING OBJECT GRINDING METHOD
摘要 Provided is a working object grinding method capable of grinding a working object reliably. A modified region forming line is set along the outer edge inside at a predetermined distance from the outer edge of the working object (1) by irradiating a focal point in the working object (1) with a laser beam. Along that modified region forming line, a modified region (7) is formed in the working object (1), and the back (12) of this working object (1) is ground. As a result, the extension of the crack, which has been formed in an outer edge portion (25) due to the grinding of the working object (1), can be suppressed by either that modified region (7) or the crack (C1) extending from the modified region (7), so that the working object (1) can be prevented from being cracked.
申请公布号 WO2009069509(A1) 申请公布日期 2009.06.04
申请号 WO2008JP70947 申请日期 2008.11.18
申请人 HAMAMATSU PHOTONICS K.K.;UCHIYAMA, NAOKI 发明人 UCHIYAMA, NAOKI
分类号 B24B1/00;B23K26/00;B24B7/22;B24B37/00;H01L21/301;H01L21/304 主分类号 B24B1/00
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