| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method capable of producing a semiconductor wafer having a polished edge part perfectly conforming to requirements relating to roughness and shape. <P>SOLUTION: This method for producing a semiconductor wafer having a polished edge includes the steps of polishing at least one side of the semiconductor wafer, and polishing the edge part of the polished semiconductor wafer, wherein the edge part is polished in the presence of a polishing agent by means of a polishing cloth containing fixed abrasive. <P>COPYRIGHT: (C)2009,JPO&INPIT |
