| 摘要 |
PROBLEM TO BE SOLVED: To simplify equipment and improve treatment efficiency by suppressing solvent vapor from leaking to the outside of a nozzle by recovering the solvent vapor discharged from the nozzle. SOLUTION: The substrate treatment equipment includes a holding bench 52 with a resist pattern formed thereon for holding an exposed and developed wafer W and a nozzle 53 for discharging solvent vapor for swelling the resist pattern to the surface of the wafer, both relatively in parallel moving for the treatment of the equipment. In the equipment, the nozzle includes a nozzle head 60 having a supply hole 67 and a discharge hole 61 of solvent vapor; and a leakage prevention part 62 provided at a position putting a nozzle head therebetween and having an opening 63 and a communication path 64 capable of sucking the solvent valor discharged at least from the discharge hole. In the supply hole of the nozzle head, a solvent valor supply source 70 and a N2 gas supply source 80 are connected via a changeover valve V1 so as to be switchable, and at an opening of the leakage preventing part, a discharge pump 90 and a N2 gas supply source for shutting off the solvent vapor are connected so as to be switchable via changeover valves V2, V3. COPYRIGHT: (C)2009,JPO&INPIT
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