| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation substrate for an electric circuit, which has high heat dissipation characteristics and also has adhesive strength substantially the same as that of a conventional heat dissipation substrate having an adhesive resin layer between a metal layer for a metal circuit and an aluminum substrate. SOLUTION: After an Al layer 3 and a metal seed layer 4 are formed, by a vapor deposition method, on a surface of an aluminum substrate 1 where an alumite coating 2 as an insulating film is formed using anodization, the Al layer 3 and alumite coating 2 are partially changed into a boehmite layer through hydration processing to form the boehmite layer 3a between the alumite coating 2 and metal seed layer 4. Then a conductive metal layer having a desired thickness is formed on the metal seed layer 4 by an electroplating method to obtain the heat dissipation substrate for the electric circuit. COPYRIGHT: (C)2009,JPO&INPIT
|
