| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a metal portion such as aluminum wiring, an electrode, and a pad corrodes, because a wafer storage container which is used even once by a batch load-lock device has halogen ions trapped deep from its surface, and it is difficult to remove them even by cleaning, so when a wafer is stored in the wafer storage container and so on for a relatively long period, halogen ions react on water in an atmosphere to produce corrosive substances. SOLUTION: The wafer storage container which is used by a batch load-lock device in a semiconductor device production line is not used by a non-batch load-lock device or for storage etc., and then metal portions can be prevented from corroding due to halogen contamination from the wafer storage container. COPYRIGHT: (C)2009,JPO&INPIT
|
