发明名称 |
Seal Ring in Semiconductor Device |
摘要 |
A semiconductor device includes a first circuit, a first seal ring and at least one first notch. The first seal ring surrounds the first circuit. The first notch cuts the first seal ring. Specifically, the first notch includes an inner opening, an outer opening and a connecting groove. The inner opening is located on the inner side of the first seal ring. The outer opening is located on the outer side of the first seal ring. The outer opening and the inner opening are not aligned. The connecting groove connects the inner opening and the outer opening. |
申请公布号 |
US2009140391(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
US20080042573 |
申请日期 |
2008.03.05 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HOU SHANG-YUN;CHEN CHUN-HUNG;TSAI CHIA-LUN;NIU PAO-KANG;JENG SHIN-PUU |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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