| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate where a semiconductor film is uniformized. <P>SOLUTION: In this semiconductor substrate 1, there are one to twenty pin holes 3 formed on each semiconductor substrate 1 having a two inch diameter, resulting in the reduction of a curvature value of the semiconductor substrate 1 after the formation of the semiconductor film. As a result, the effect of reducing the size variation after exposure can be obtained. It can be assumed that the presence of the pin holes 3 will cancel the dislocation on the surface of the semiconductor substrate 1. Therefore, the film quality of semiconductor substrate and performance of semiconductor device can be uniformized and cracking of semiconductor substrate 1 can be prevented. <P>COPYRIGHT: (C)2009,JPO&INPIT |
