| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which mounts a packaged semiconductor chip on a mounting board and which can easily remove a semiconductor chip being found to have initial failure. SOLUTION: A first pad (2) is formed on the surface of a first substrate (1). A metal film (3) is arranged on the surface of the first pad (2). A second substrate (6) is so arranged that it is opposed to the surface of the first substrate (1) on which the first pad (2) is formed. A second pad (7) is formed on the surface of the second substrate (6) which is opposed to the first pad (2). Ends of one side of conductive nanotubes (8) are connected with the second pad (7) and their ends of the other side are embedded in the metal film (3). An intermediate film (9) which is made of a conductive compound including at least one constituent element of the nanotubes (8) and at least one constituent element of the first pad (1) is arranged at the interface between the metal film (3) and the nanotubes (8). COPYRIGHT: (C)2009,JPO&INPIT |
