| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated semiconductor package with an improved bonding reliability. <P>SOLUTION: The laminated semiconductor package includes a lower package 100a having a lower substrate 110 and a lower semiconductor chip 150 mounted on one surface of the lower substrate 110, an upper package 100b mounted on the lower package 100a and having an upper substrate 200 and at least one or more upper semiconductor chips 240, 250 mounted on one surface of the upper substrate 200, a joint member 310 arranged between the lower package 100a and the upper package 100b to electrically connect the lower package 100a and the upper package 100b, and a lower sealing member 320 arranged between the upper substrate 200 of the upper package 100b and the lower substrate 110 of the lower package 100a to actually surround the joint member 310 for protecting the lower semiconductor chip 150. <P>COPYRIGHT: (C)2009,JPO&INPIT |
