POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide an alkali-developable positive photosensitive resin composition that is capable of forming a superior relief pattern, after development and after heat curing.

SOLUTION: The positive photosensitive resin composition comprises (A) 100 parts by mass of a polymer which is an alkali-soluble phenolic resin, polyhydroxystyrene or polyhydroxystyrene derivative; (B) 1-100 parts by mass of a photosensitive diazonaphthoquinone compound; (C) 10-30 parts by mass of a crosslinking agent; (D) 0.1-30 parts by mass of at least one acid derivative compound selected from compounds represented by the formulae of group (1); and (E) 100-1,000 parts by mass of an organic solvent.

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