| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging device and a nozzle presence/absence detecting method which can cancel a disadvantage caused when a nozzle presence/absence is detected based on a measurement result of a degree of vacuum upon vacuum suction. <P>SOLUTION: In the electronic component packaging device for picking up an electronic component by a chucking nozzle 20 attached detachably to a mounting head by a vacuum chucking to package it onto a board, this device includes a flow rate sensor 24 interposing in an air blow circuit extending from an air supply source 26 to the chucking nozzle 20. The air supply source 26 is driven to discharge a positive pressure air, while a flow rate of an air flowing in the air blow circuit is measured by the flow rate sensor 24. A determination part 27 compares the flow rate measurement result with a determination parameter, thereby determining a presence/absence of the chucking nozzle 20 in the mounting head. <P>COPYRIGHT: (C)2009,JPO&INPIT |
