| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which is usable as a dicing tape having sufficient adhesive strength for a ring frame during dicing and easily peeled during tape releasing to leave no pressure-sensitive adhesive waste on a ring frame, and enables a wafer to be mounted as the pressure-sensitive adhesive is imparted to the wafer. SOLUTION: The pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer consisting of a pressure-sensitive adhesive component (a) a thermoplastic resin, (b) a thermopolymerizable component, and (c) a compound producing a base and a radical through irradiation, and (d)≤20 wt.% of a radiation polymerizable compound for the total amount of the pressure-sensitive adhesive component; and a support base material. The softening point of (b) the thermopolymerizable component of the pressure-sensitive adhesive component being≥50°C. COPYRIGHT: (C)2009,JPO&INPIT |
