SEMICONDUCTOR ELEMENT, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve a problem wherein reliability of an element is degraded which occurs in a process of forming via plugs electrically connecting metal wires. SOLUTION: This manufacturing method of a semiconductor element includes steps of forming: multiple metal wires on a semiconductor substrate; a reaction prevention film on the metal wires in a region with via holes formed therein; an interlayer insulation film on the semiconductor substrate including the reaction prevention film; via holes by etching the interlayer insulation film above the reaction prevention film; and the via plugs in the via holes. COPYRIGHT: (C)2009,JPO&INPIT